Microchip Technology A2F500M3G-CS288

Package / Case

288-TFBGA, CSPBGA

Supplier Device Package

288-CSP (11x11)

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

N

Maximum Clock Frequency

80 MHz

L1 Cache Instruction Memory

-

L1 Cache Data Memory

-

Data RAM Size

64 kB

Number of Logic Elements

6000 LE

Moisture Sensitive

Yes

Number of Logic Array Blocks - LABs

-

Factory Pack QuantityFactory Pack Quantity

176

Tradename

SmartFusion

Number of I/Os

MCU - 31, FPGA - 78

Package

Tray

Base Product Number

A2F500

Mfr

Microchip Technology

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

A2F500

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

0°C ~ 85°C (TJ)

Speed

80MHz

RAM Size

64KB

Core Processor

ARM® Cortex®-M3

Peripherals

DMA, POR, WDT

Program Memory Size

512 kB

Connectivity

EBI/EMI, Ethernet, I²C, SPI, UART/USART

Architecture

MCU, FPGA

Primary Attributes

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

Number of Cores

1 Core

Flash Size

512KB