Microchip Technology M2S025TS-1FGG484

Lifecycle Status

Production (Last Updated: 2 months ago)

Package / Case

FPBGA-484

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

484-FPBGA (23x23)

Number of Terminals

484

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Mounting Styles

SMD/SMT

Maximum Clock Frequency

166 MHz

L1 Cache Instruction Memory

-

L1 Cache Data Memory

-

Data RAM Size

64 kB

Number of Logic Elements

27696 LE

Moisture Sensitive

Yes

Number of Logic Array Blocks - LABs

2308 LAB

Factory Pack QuantityFactory Pack Quantity

60

Number of I/Os

267

Package

Tray

Base Product Number

M2S025

Mfr

Microchip Technology

Product Status

Active

Package Description

FBGA-484

Package Style

GRID ARRAY

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA484,22X22,40

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

40

Supply Voltage-Min

1.14 V

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

M2S025TS-1FGG484

Package Code

BGA

Package Shape

SQUARE

Part Life Cycle Code

Active

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

1.26 V

Risk Rank

5.8

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

SmartFusion2

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

0°C ~ 85°C (TJ)

JESD-609 Code

e1

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.39.00.01

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

250

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

compliant

JESD-30 Code

S-PBGA-B484

Number of Outputs

267

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

1.2 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Speed

166MHz

RAM Size

64KB

Core Processor

ARM® Cortex®-M3

Peripherals

DDR, PCIe, SERDES

Program Memory Size

256 kB

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Architecture

MCU, FPGA

Number of Inputs

267

Seated Height-Max

2.44 mm

Programmable Logic Type

Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes

FPGA - 25K Logic Modules

Number of Logic Cells

An FPGA contains a large number of logic cells. Each logic cell can be configured to implement a certain set of functions. Each logic cell has a fixed number of inputs and outputs. Flip-flop can be incorporated into a multiplexer-based logic module to implement sequential logic.

27696

Number of Cores

1 Core

Flash Size

256KB

Width

23 mm

Length

23 mm