Microchip Technology A2F200M3F-1CS288

Package / Case

288-TFBGA, CSPBGA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

288-CSP (11x11)

Number of Terminals

288

RoHS

N

Maximum Clock Frequency

100 MHz

L1 Cache Instruction Memory

-

L1 Cache Data Memory

-

Data RAM Size

64 kB

Number of Logic Elements

2000 LE

Moisture Sensitive

Yes

Number of Logic Array Blocks - LABs

-

Factory Pack QuantityFactory Pack Quantity

176

Tradename

SmartFusion

Number of I/Os

MCU - 31, FPGA - 78

Package

Tray

Base Product Number

A2F200

Mfr

Microchip Technology

Product Status

Active

Package Description

TFBGA, BGA288,21X21,20

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA288,21X21,20

Supply Voltage-Nom

1.5 V

Reflow Temperature-Max (s)

NOT SPECIFIED

Supply Voltage-Min

1.425 V

Operating Temperature-Max

85 °C

Rohs Code

No

Manufacturer Part Number

A2F200M3F-1CS288

Clock Frequency-Max

100 MHz

Package Code

TFBGA

Package Shape

SQUARE

Part Life Cycle Code

Active

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

1.575 V

Risk Rank

5.24

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

A2F200

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

0°C ~ 85°C (TJ)

JESD-609 Code

e0

Terminal Finish

TIN LEAD SILVER

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.39.00.01

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Terminal Pitch

The center distance from one pole to the next.

0.5 mm

Reach Compliance Code

compliant

JESD-30 Code

S-PBGA-B288

Number of Outputs

78

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

1.5,1.8,2.5,3.3 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Speed

100MHz

RAM Size

64KB

Core Processor

ARM® Cortex®-M3

Peripherals

DMA, POR, WDT

Program Memory Size

256 kB

Connectivity

EBI/EMI, Ethernet, I²C, SPI, UART/USART

Architecture

MCU, FPGA

Number of Inputs

78

Organization

4608 CLBS, 200000 GATES

Seated Height-Max

1.05 mm

Programmable Logic Type

Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

Number of CLBs

4608

Number of Logic Cells

An FPGA contains a large number of logic cells. Each logic cell can be configured to implement a certain set of functions. Each logic cell has a fixed number of inputs and outputs. Flip-flop can be incorporated into a multiplexer-based logic module to implement sequential logic.

4608

Number of Cores

1 Core

Number of Equivalent Gates

200000

Flash Size

256KB

Width

11 mm

Length

11 mm