Microchip Technology M2S090-1FGG484

Package / Case

FPBGA-484

Supplier Device Package

484-FPBGA (23x23)

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Mounting Styles

SMD/SMT

Maximum Clock Frequency

166 MHz

L1 Cache Instruction Memory

-

L1 Cache Data Memory

-

Data RAM Size

64 kB

Number of Logic Elements

86316 LE

Moisture Sensitive

Yes

Number of Logic Array Blocks - LABs

7193 LAB

Factory Pack QuantityFactory Pack Quantity

60

Typical Operating Supply Voltage

1.2000 V

Number of I/Os

267

Package

Tray

Base Product Number

M2S090

Mfr

Microchip Technology

Product Status

Active

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

SmartFusion2

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

0 to 85 °C

Speed

166MHz

RAM Size

64KB

Core Processor

ARM® Cortex®-M3

Peripherals

DDR, PCIe, SERDES

Program Memory Size

512 kB

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Architecture

MCU, FPGA

Speed Grade

1

Primary Attributes

FPGA - 90K Logic Modules

Number of Cores

1 Core

Flash Size

512KB