A2F500M3G-FG256

Microchip Technology A2F500M3G-FG256

Part No:

A2F500M3G-FG256

Datasheet:

-

Package:

FPBGA-256

AINNX NO:

30890384-A2F500M3G-FG256

Description:

SoC FPGA A2F500M3G-FG256

Products specifications
  • Package / Case
    FPBGA-256
  • Supplier Device Package
    256-FPBGA (17x17)
  • Shipping Restrictions
    This product may require additional documentation to export from the United States.
  • RoHS
    N
  • Mounting Styles
    SMD/SMT
  • Maximum Clock Frequency
    80 MHz
  • L1 Cache Instruction Memory
    -
  • L1 Cache Data Memory
    -
  • Data RAM Size
    64 kB
  • Number of Logic Elements
    6000 LE
  • Number of I/Os
    117 I/O
  • Minimum Operating Temperature
    0 C
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 85 C
  • Moisture Sensitive
    Yes
  • Number of Logic Array Blocks - LABs
    -
  • Factory Pack QuantityFactory Pack Quantity
    90
  • Tradename
    SmartFusion
  • Typical Operating Supply Voltage
    1.5000 V
  • Minimum Operating Supply Voltage
    1.425 V
  • Device Logic Gates
    500000
  • Maximum Operating Supply Voltage
    1.575 V
  • Package
    Tray
  • Base Product Number
    A2F500
  • Mfr
    Microchip Technology
  • Product Status
    Active
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    A2F500
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    0 to 85 °C
  • Operating Supply Current
    2 mA
  • Speed
    80MHz
  • RAM Size
    64KB
  • Core Processor
    ARM® Cortex®-M3
  • Peripherals
    DMA, POR, WDT
  • Program Memory Size
    512 kB
  • Connectivity
    EBI/EMI, Ethernet, I²C, SPI, UART/USART
  • Architecture
    MCU, FPGA
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    500000
  • Speed Grade
    STD
  • Primary Attributes
    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
  • Number of Cores
    1 Core
  • Flash Size
    512KB
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