Microchip Technology M2S060-1FCS325I

Lifecycle Status

Production (Last Updated: 2 months ago)

Package / Case

325-TFBGA, FCBGA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

325-FCBGA (11x11)

Number of Terminals

325

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

N

Maximum Clock Frequency

166 MHz

L1 Cache Instruction Memory

-

L1 Cache Data Memory

-

Data RAM Size

64 kB

Number of Logic Elements

56520 LE

Moisture Sensitive

Yes

Number of Logic Array Blocks - LABs

4710 LAB

Factory Pack QuantityFactory Pack Quantity

176

Tradename

SmartFusion2

Number of I/Os

200

Package

Tray

Base Product Number

M2S060

Mfr

Microchip Technology

Product Status

Active

Package Description

FBGA-325

Package Style

GRID ARRAY, THIN PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA325,21X21,20

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

30

Supply Voltage-Min

1.14 V

Rohs Code

No

Manufacturer Part Number

M2S060-1FCS325I

Package Code

TFBGA

Package Shape

SQUARE

Part Life Cycle Code

Active

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

1.26 V

Risk Rank

5.87

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

SmartFusion2

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 100°C (TJ)

JESD-609 Code

e0

Terminal Finish

Tin/Lead (Sn/Pb)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

LG-MIN, WD-MIN

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.39.00.01

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

240

Terminal Pitch

The center distance from one pole to the next.

0.5 mm

Reach Compliance Code

not_compliant

JESD-30 Code

S-PBGA-B325

Number of Outputs

200

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

1.2 V

Speed

166MHz

RAM Size

64KB

Core Processor

ARM® Cortex®-M3

Peripherals

DDR, PCIe, SERDES

Program Memory Size

256 kB

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Architecture

MCU, FPGA

Number of Inputs

200

Seated Height-Max

1.01 mm

Programmable Logic Type

Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes

FPGA - 60K Logic Modules

Number of Logic Cells

An FPGA contains a large number of logic cells. Each logic cell can be configured to implement a certain set of functions. Each logic cell has a fixed number of inputs and outputs. Flip-flop can be incorporated into a multiplexer-based logic module to implement sequential logic.

56520

Number of Cores

1 Core

Flash Size

256KB

Width

11 mm

Length

11 mm