Microchip Technology M2S010T-1VFG400I

Package / Case

VFPBGA-400

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

400-VFBGA (17x17)

Number of Terminals

400

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

Details

Mounting Styles

SMD/SMT

Maximum Clock Frequency

166 MHz

L1 Cache Instruction Memory

-

L1 Cache Data Memory

-

Data RAM Size

64 kB

Number of Logic Elements

12084 LE

Moisture Sensitive

Yes

Number of Logic Array Blocks - LABs

1007 LAB

Factory Pack QuantityFactory Pack Quantity

90

Typical Operating Supply Voltage

2.5, 3.3 V

Minimum Operating Supply Voltage

1.14 V

Maximum Operating Supply Voltage

1.26 V

Number of I/Os

195

Package

Tray

Base Product Number

M2S010

Mfr

Microchip Technology

Product Status

Active

Package Description

LFBGA, BGA400,20X20,32

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Moisture Sensitivity Levels

3

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA400,20X20,32

Supply Voltage-Nom

1.2 V

Reflow Temperature-Max (s)

40

Supply Voltage-Min

1.14 V

Rohs Code

Yes

Manufacturer Part Number

M2S010T-1VFG400I

Package Code

LFBGA

Package Shape

SQUARE

Part Life Cycle Code

Active

Ihs Manufacturer

MICROSEMI CORP

Supply Voltage-Max

1.26 V

Risk Rank

5.27

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

SmartFusion2

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40 to 100 °C

JESD-609 Code

e1

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

250

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

compliant

JESD-30 Code

S-PBGA-B400

Number of Outputs

195

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

1.2 V

Speed

166MHz

RAM Size

64KB

Core Processor

ARM® Cortex®-M3

Peripherals

DDR, PCIe, SERDES

Program Memory Size

256 kB

Connectivity

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Architecture

MCU, FPGA

Number of Inputs

195

Seated Height-Max

1.51 mm

Programmable Logic Type

Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

FIELD PROGRAMMABLE GATE ARRAY

Speed Grade

1

Primary Attributes

FPGA - 10K Logic Modules

Number of Logic Cells

An FPGA contains a large number of logic cells. Each logic cell can be configured to implement a certain set of functions. Each logic cell has a fixed number of inputs and outputs. Flip-flop can be incorporated into a multiplexer-based logic module to implement sequential logic.

12084

Number of Cores

1 Core

Flash Size

256KB

Width

17 mm

Length

17 mm