Microchip Technology A2F500M3G-1PQ208I

Package / Case

208-BFQFP

Supplier Device Package

208-PQFP (28x28)

Shipping Restrictions

This product may require additional documentation to export from the United States.

RoHS

N

Mounting Styles

SMD/SMT

Maximum Clock Frequency

100 MHz

L1 Cache Instruction Memory

-

L1 Cache Data Memory

-

Data RAM Size

64 kB

Number of Logic Elements

6000 LE

Number of I/Os

113 I/O

Minimum Operating Temperature

- 40 C

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 100 C

Moisture Sensitive

Yes

Number of Logic Array Blocks - LABs

-

Factory Pack QuantityFactory Pack Quantity

24

Tradename

SmartFusion

Unit Weight

0.183425 oz

Package

Tray

Base Product Number

A2F500M3G

Mfr

Microchip Technology

Product Status

Obsolete

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

A2F500

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 100°C (TJ)

Speed

100MHz

RAM Size

64KB

Core Processor

ARM® Cortex®-M3

Peripherals

DMA, POR, WDT

Program Memory Size

512 kB

Connectivity

Ethernet, I²C, SPI, UART/USART

Architecture

MCU, FPGA

Number of Gates

The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

500000

Primary Attributes

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

Number of Cores

1 Core

Flash Size

512KB