MML60R190PTH

MagnaChip MML60R190PTH

Part No:

MML60R190PTH

Manufacturer:

MagnaChip

Datasheet:

-

Package:

-

AINNX NO:

31978399-MML60R190PTH

Description:

Products specifications
  • Mount
    Through Hole
  • Number of Pins
    3
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Automotive
    Unknown
  • PPAP
    Unknown
  • Category
    Power MOSFET
  • Process Technology
    Super Junction
  • Channel Mode
    Enhancement
  • Number of Elements per Chip
    1
  • Maximum Drain Source Voltage (V)
    600
  • Maximum Gate Source Voltage (V)
    ±30
  • Maximum Gate Threshold Voltage (V)
    4
  • Maximum Continuous Drain Current (A)
    20
  • Maximum Gate Source Leakage Current (nA)
    100
  • Maximum IDSS (uA)
    1
  • Typical Gate Charge @ Vgs (nC)
    51@10V
  • Typical Gate Charge @ 10V (nC)
    51
  • Typical Input Capacitance @ Vds (pF)
    1630@25V
  • Maximum Power Dissipation (mW)
    154000
  • Typical Fall Time (ns)
    47
  • Typical Rise Time (ns)
    73
  • Typical Turn-Off Delay Time (ns)
    146
  • Typical Turn-On Delay Time (ns)
    32
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Mounting
    Through Hole
  • Package Height
    9.65(Max)
  • Package Width
    4.83(Max)
  • Package Length
    10.29(Max)
  • PCB changed
    3
  • Tab
    Tab
  • Standard Package Name
    I2PAK
  • Supplier Package
    TO-262
  • Lead Shape
    Through Hole
  • RoHS
    Non-Compliant
  • Turn Off Delay Time

    It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

    146 ns
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Unconfirmed
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    150 °C
  • Min Operating Temperature
    -55 °C
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    154 W
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • Configuration
    Single
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Single
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    32 ns
  • Continuous Drain Current (ID)
    20 A
  • Gate to Source Voltage (Vgs)
    30 V
  • Input Capacitance

    The capacitance between the input terminals of an op amp with either input grounded. It is expressed in units of farads.

    1.63 nF
  • Channel Type
    N
  • Drain to Source Resistance
    190 mΩ
  • Width
    4.63 mm
  • Height
    11.05 mm
  • Length
    10.29 mm
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