Mount
Through Hole
Number of Pins
3
EU RoHS
Compliant
ECCN (US)
EAR99
Automotive
Unknown
PPAP
Unknown
Category
Power MOSFET
Process Technology
Super Junction
Channel Mode
Enhancement
Number of Elements per Chip
1
Maximum Drain Source Voltage (V)
600
Maximum Gate Source Voltage (V)
±30
Maximum Gate Threshold Voltage (V)
4
Maximum Continuous Drain Current (A)
20
Maximum Gate Source Leakage Current (nA)
100
Maximum IDSS (uA)
1
Typical Gate Charge @ Vgs (nC)
51@10V
Typical Gate Charge @ 10V (nC)
51
Typical Input Capacitance @ Vds (pF)
1630@25V
Maximum Power Dissipation (mW)
154000
Typical Fall Time (ns)
47
Typical Rise Time (ns)
73
Typical Turn-Off Delay Time (ns)
146
Typical Turn-On Delay Time (ns)
32
Minimum Operating Temperature (°C)
-55
Maximum Operating Temperature (°C)
150
Mounting
Through Hole
Package Height
9.65(Max)
Package Width
4.83(Max)
Package Length
10.29(Max)
PCB changed
3
Tab
Tab
Standard Package Name
I2PAK
Supplier Package
TO-262
Lead Shape
Through Hole
RoHS
Non-Compliant
Turn Off Delay Time
It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.
146 ns
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tube
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Unconfirmed
Max Operating Temperature
The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
150 °C
Min Operating Temperature
-55 °C
Max Power Dissipation
The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.
154 W
Pin Count
a count of all of the component leads (or pins)
3
Configuration
Single
Element Configuration
The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.
Single
Turn On Delay Time
Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.
32 ns
Continuous Drain Current (ID)
20 A
Gate to Source Voltage (Vgs)
30 V
Input Capacitance
The capacitance between the input terminals of an op amp with either input grounded. It is expressed in units of farads.
1.63 nF
Channel Type
N
Drain to Source Resistance
190 mΩ
Width
4.63 mm
Height
11.05 mm
Length
10.29 mm