MagnaChip MDF1933TH

Material

Si

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

Unknown

PPAP

Unknown

Category

Power MOSFET

Process Technology

TMOS

Channel Mode

Enhancement

Number of Elements per Chip

1

Maximum Drain Source Voltage (V)

80

Maximum Gate Source Voltage (V)

±20

Maximum Gate Threshold Voltage (V)

4

Maximum Continuous Drain Current (A)

43

Maximum Gate Source Leakage Current (nA)

100

Maximum IDSS (uA)

1

Maximum Drain Source Resistance (mOhm)

7.5@10V

Typical Gate Charge @ Vgs (nC)

59.4@10V

Typical Gate Charge @ 10V (nC)

59.4

Typical Input Capacitance @ Vds (pF)

3841@40V

Maximum Power Dissipation (mW)

27700

Typical Fall Time (ns)

15.1

Typical Rise Time (ns)

32.7

Typical Turn-Off Delay Time (ns)

24.2

Typical Turn-On Delay Time (ns)

15.6

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Mounting

Through Hole

Package Height

16.13(Max)

Package Width

4.93(Max)

Package Length

10.71(Max)

PCB changed

3

Tab

Tab

Standard Package Name

TO-220

Supplier Package

TO-220F

Lead Shape

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Unconfirmed

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Single

Channel Type

N