MDQ16N50GTP

MagnaChip MDQ16N50GTP

Part No:

MDQ16N50GTP

Manufacturer:

MagnaChip

Datasheet:

-

Package:

-

AINNX NO:

31974896-MDQ16N50GTP

Description:

Products specifications
  • Mount
    Through Hole
  • Number of Pins
    3
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • HTS
    8541.29.00.95
  • Automotive
    Unknown
  • PPAP
    Unknown
  • Category
    Power MOSFET
  • Channel Mode
    Enhancement
  • Number of Elements per Chip
    1
  • Maximum Drain Source Voltage (V)
    500
  • Maximum Gate Source Voltage (V)
    ±30
  • Maximum Gate Threshold Voltage (V)
    5
  • Maximum Continuous Drain Current (A)
    16.5
  • Maximum Gate Source Leakage Current (nA)
    100
  • Maximum IDSS (uA)
    1
  • Typical Gate Charge @ Vgs (nC)
    34.9@10V
  • Typical Gate Charge @ 10V (nC)
    34.9
  • Typical Input Capacitance @ Vds (pF)
    1724@25V
  • Maximum Power Dissipation (mW)
    215000
  • Typical Fall Time (ns)
    41
  • Typical Rise Time (ns)
    88.5
  • Typical Turn-Off Delay Time (ns)
    96.5
  • Typical Turn-On Delay Time (ns)
    46
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Mounting
    Through Hole
  • Package Height
    21.46(Max)
  • Package Width
    5.31(Max)
  • Package Length
    16.26(Max)
  • PCB changed
    3
  • Tab
    Tab
  • Standard Package Name
    TO-247
  • Supplier Package
    TO-247
  • Lead Shape
    Through Hole
  • Number of Elements
    1
  • RoHS
    Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Unconfirmed
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    150 °C
  • Min Operating Temperature
    -55 °C
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • Configuration
    Single
  • Power Dissipation

    the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

    215 W
  • Continuous Drain Current (ID)
    16.5 A
  • Gate to Source Voltage (Vgs)
    30 V
  • Channel Type
    N
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
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