EU RoHS
Compliant with Exemption
ECCN (US)
EAR99
HTS
8541.29.00.95
Automotive
Unknown
PPAP
Unknown
Category
Power MOSFET
Channel Mode
Enhancement
Number of Elements per Chip
1
Maximum Drain Source Voltage (V)
600
Maximum Gate Source Voltage (V)
±30
Maximum Continuous Drain Current (A)
8
Maximum Drain Source Resistance (MOhm)
580@10V
Typical Gate Charge @ Vgs (nC)
18@10V
Typical Gate Charge @ 10V (nC)
18
Typical Input Capacitance @ Vds (pF)
575@25V
Maximum Power Dissipation (mW)
70000
Typical Fall Time (ns)
25
Typical Rise Time (ns)
34
Typical Turn-Off Delay Time (ns)
48
Supplier Package
DPAK
Tab
Tab
PCB changed
2
Package Length
6.73(Max)
Package Width
6.1
Package Height
2.39(Max)
Mounting
Surface Mount
Maximum Operating Temperature (°C)
150
Minimum Operating Temperature (°C)
-55
Typical Turn-On Delay Time (ns)
14
Continuous Drain Current
8(A)
Drain-Source On-Volt
600(V)
Operating Temperature Classification
Military
Package Type
DPAK
Operating Temp Range
-55C to 150C
Gate-Source Voltage (Max)
±30(V)
Number of Elements
1
Rad Hardened
No
Schedule B
8541290080, 8541290080/8541290080/8541290080/8541290080/8541290080
RoHS
Non-Compliant
Package Description
,
Manufacturer Part Number
MMD60R580PBRH
Manufacturer
MagnaChip Semiconductor Ltd
Part Life Cycle Code
Active
Ihs Manufacturer
MAGNACHIP SEMICONDUCTOR LTD
Risk Rank
1.5
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tape and Reel
Part Status
Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.
Active
Type
Power MOSFET
Reach Compliance Code
unknown
Pin Count
a count of all of the component leads (or pins)
3
Polarity
N
Configuration
Single
Power Dissipation
the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.
70(W)
Channel Type
N