MagnaChip MMIS70R1K4PTH

ECCN (US)

EAR99

Automotive

Unknown

PPAP

Unknown

Category

Power MOSFET

Process Technology

Super Junction

Channel Mode

Enhancement

Number of Elements per Chip

1

Maximum Drain Source Voltage (V)

700

Maximum Gate Source Voltage (V)

±30

Maximum Gate Threshold Voltage (V)

4

Maximum Continuous Drain Current (A)

3.2

Maximum Gate Source Leakage Current (nA)

100

Maximum IDSS (uA)

1

Maximum Drain Source Resistance (mOhm)

1400@10V

Typical Gate Charge @ Vgs (nC)

11@10V

Typical Gate Charge @ 10V (nC)

11

Typical Input Capacitance @ Vds (pF)

312@25V

Maximum Power Dissipation (mW)

33000

Typical Fall Time (ns)

21

Typical Rise Time (ns)

20

Typical Turn-Off Delay Time (ns)

33

Typical Turn-On Delay Time (ns)

9

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Mounting

Through Hole

Package Height

6.22(Max)

Package Width

2.39(Max)

Package Length

6.73(Max)

PCB changed

3

Tab

Tab

Standard Package Name

TO-251

Supplier Package

IPAK

Lead Shape

Through Hole

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Single

Channel Type

N