MDP1923TH

MagnaChip MDP1923TH

Part No:

MDP1923TH

Manufacturer:

MagnaChip

Datasheet:

-

Package:

-

AINNX NO:

31974901-MDP1923TH

Description:

Products specifications
  • Mount
    Through Hole
  • Number of Pins
    3
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • HTS
    8541.29.00.95
  • Automotive
    Unknown
  • PPAP
    Unknown
  • Category
    Power MOSFET
  • Process Technology
    TMOS
  • Channel Mode
    Enhancement
  • Number of Elements per Chip
    1
  • Maximum Drain Source Voltage (V)
    100
  • Maximum Gate Source Voltage (V)
    ±20
  • Maximum Gate Threshold Voltage (V)
    4
  • Maximum Continuous Drain Current (A)
    69
  • Maximum Gate Source Leakage Current (nA)
    100
  • Maximum IDSS (uA)
    1
  • Typical Gate Charge @ Vgs (nC)
    42.8@10V
  • Typical Gate Charge @ 10V (nC)
    42.8
  • Typical Input Capacitance @ Vds (pF)
    2802@40V
  • Maximum Power Dissipation (mW)
    139000
  • Typical Fall Time (ns)
    11.9
  • Typical Rise Time (ns)
    10.1
  • Typical Turn-Off Delay Time (ns)
    32.5
  • Typical Turn-On Delay Time (ns)
    10.6
  • Minimum Operating Temperature (°C)
    -55
  • Maximum Operating Temperature (°C)
    150
  • Mounting
    Through Hole
  • Package Height
    9.65(Max)
  • Package Width
    4.83(Max)
  • Package Length
    10.67(Max)
  • PCB changed
    3
  • Tab
    Tab
  • Standard Package Name
    TO-220
  • Supplier Package
    TO-220
  • RoHS
    Non-Compliant
  • Turn Off Delay Time

    It is the time from when Vgs drops below 90% of the gate drive voltage to when the drain current drops below 90% of the load current. It is the delay before current starts to transition in the load, and depends on Rg. Ciss.

    32.5 ns
  • Package Description
    ,
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Rohs Code
    Yes
  • Manufacturer Part Number
    MDP1923TH
  • Manufacturer
    MagnaChip Semiconductor Ltd
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    MAGNACHIP SEMICONDUCTOR LTD
  • Risk Rank
    5.74
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    150 °C
  • Min Operating Temperature
    -55 °C
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    139 W
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Reach Compliance Code
    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • Configuration
    Single
  • Element Configuration

    The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

    Single
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    10.6 ns
  • Continuous Drain Current (ID)
    69 A
  • Gate to Source Voltage (Vgs)
    20 V
  • Input Capacitance

    The capacitance between the input terminals of an op amp with either input grounded. It is expressed in units of farads.

    2.802 nF
  • Channel Type
    N
  • Drain to Source Resistance
    13.9 mΩ
  • Width
    4.83 mm
  • Height
    16.51 mm
  • Length
    10.67 mm
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