MagnaChip MMD60R900PRH

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.29.00.95

Automotive

Unknown

PPAP

Unknown

Category

Power MOSFET

Process Technology

Super Junction

Channel Mode

Enhancement

Number of Elements per Chip

1

Maximum Drain Source Voltage (V)

600

Maximum Gate Source Voltage (V)

±30

Maximum Gate Threshold Voltage (V)

4

Maximum Continuous Drain Current (A)

4.5

Maximum Gate Source Leakage Current (nA)

100

Maximum IDSS (uA)

1

Typical Gate Charge @ Vgs (nC)

12.3@10V

Typical Gate Charge @ 10V (nC)

12.3

Typical Input Capacitance @ Vds (pF)

396@25V

Maximum Power Dissipation (mW)

38000

Typical Fall Time (ns)

34

Typical Rise Time (ns)

29

Typical Turn-Off Delay Time (ns)

151

Typical Turn-On Delay Time (ns)

15

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Mounting

Surface Mount

Package Height

2.39(Max)

Package Width

6.1

Package Length

6.73(Max)

PCB changed

2

Tab

Tab

Standard Package Name

TO-252

Supplier Package

DPAK

Lead Shape

Gull-wing

Package Description

,

Manufacturer Part Number

MMD60R900PRH

Manufacturer

MagnaChip Semiconductor Ltd

Part Life Cycle Code

Active

Ihs Manufacturer

MAGNACHIP SEMICONDUCTOR LTD

Risk Rank

5.69

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel|Tube

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Single

Channel Type

N