MagnaChip MDH3331RP

EU RoHS

Compliant

ECCN (US)

EAR99

Automotive

Unknown

PPAP

Unknown

Category

Power MOSFET

Process Technology

TMOS

Channel Mode

Enhancement

Number of Elements per Chip

1

Maximum Drain Source Voltage (V)

20

Maximum Gate Source Voltage (V)

±12

Maximum Gate Threshold Voltage (V)

1.5

Maximum Continuous Drain Current (A)

3.5

Maximum Gate Source Leakage Current (nA)

100

Maximum IDSS (uA)

1

Typical Gate Charge @ Vgs (nC)

Typical Input Capacitance @ Vds (pF)

472@10V

Maximum Power Dissipation (mW)

1400

Typical Fall Time (ns)

11.8

Typical Rise Time (ns)

24.8

Typical Turn-Off Delay Time (ns)

30

Typical Turn-On Delay Time (ns)

3

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Mounting

Surface Mount

Package Height

1.1

Package Width

1.63

Package Length

2.93

PCB changed

3

Standard Package Name

SOT

Supplier Package

SOT-23

Lead Shape

Gull-wing

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Unconfirmed

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Single

Channel Type

P