MagnaChip MDD3N50GRH

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.29.00.95

Automotive

Unknown

PPAP

Unknown

Category

Power MOSFET

Channel Mode

Enhancement

Number of Elements per Chip

1

Maximum Drain Source Voltage (V)

500

Maximum Gate Source Voltage (V)

±30

Maximum Gate Threshold Voltage (V)

5

Maximum Continuous Drain Current (A)

2.8

Maximum Gate Source Leakage Current (nA)

100

Maximum IDSS (uA)

1

Typical Gate Charge @ Vgs (nC)

6.75@10V

Typical Gate Charge @ 10V (nC)

6.75

Typical Input Capacitance @ Vds (pF)

285@25V

Maximum Power Dissipation (mW)

45000

Typical Fall Time (ns)

20

Typical Rise Time (ns)

22

Typical Turn-Off Delay Time (ns)

33

Typical Turn-On Delay Time (ns)

19

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Mounting

Surface Mount

Package Height

2.39(Max)

Package Width

6.1

Package Length

6.73(Max)

PCB changed

2

Tab

Tab

Standard Package Name

TO-252

Supplier Package

DPAK

Lead Shape

Gull-wing

Reflow Temperature-Max (s)

NOT SPECIFIED

Rohs Code

Yes

Manufacturer Part Number

MDD3N50GRH

Manufacturer

MagnaChip Semiconductor Ltd

Part Life Cycle Code

Active

Ihs Manufacturer

MAGNACHIP SEMICONDUCTOR LTD

Risk Rank

5.73

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

unknown

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Single

Channel Type

N