Infineon Technologies XMC4500F144K1024ACXQMA1

Factory Lead Time

13 Weeks

Mounting Type

Surface Mount

Package / Case

144-LQFP Exposed Pad

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

144

Weight

1.290414g

Data Converters

A/D 32x12b; D/A 2x12b

Number of I/Os

91

Watchdog Timers

Yes

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C~125°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

XMC4000

Published

2013

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Number of Terminations

144

Terminal Finish

Tin (Sn)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

ADC CONVERTOR CONSIDERED AS PER O DOCUMENT

Max Power Dissipation

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

1W

Terminal Position

QUAD

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Supply Voltage

3.3V

Terminal Pitch

The center distance from one pole to the next.

0.5mm

Frequency

120MHz

Operating Supply Voltage

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

1.3V

Supply Voltage-Max (Vsup)

3.63V

Interface

CAN, EBI/EMI, Ethernet, I2C, I2S, LIN, SPI, UART, USB

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

1MB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

Internal

RAM Size

160K x 8

Voltage - Supply (Vcc/Vdd)

3.13V~3.63V

uPs/uCs/Peripheral ICs Type

MICROCONTROLLER, RISC

Core Processor

ARM® Cortex®-M4

Peripherals

DMA, I2S, LED, POR, PWM, WDT

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

FLASH

Core Size

32-Bit

Program Memory Size

1MB 1M x 8

Connectivity

CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART, USB

Bit Size

32

Has ADC

YES

DMA Channels

YES

Data Bus Width

32b

PWM Channels

YES

Halogen Free

Halogen Free

Number of Timers/Counters

4

Core Architecture

ARM

On Chip Program ROM Width

8

Number of ADC Channels

32

Length

20mm

Height Seated (Max)

1.6mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free