XC167CI16F40FBBFXQMA1

Infineon Technologies XC167CI16F40FBBFXQMA1

Part No:

XC167CI16F40FBBFXQMA1

Datasheet:

XC167CI-16F

Package:

144-LQFP

ROHS:

AINNX NO:

4860020-XC167CI16F40FBBFXQMA1

Description:

MCU 16-bit XC166 CISC/DSP/RISC 128KB Flash 2.5V/5V 144-Pin TQFP

Products specifications
  • Factory Lead Time
    12 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    144-LQFP
  • Number of Pins
    144
  • Data Converters
    A/D 16x8/10b
  • Number of I/Os
    103
  • ROM(word)
    131072
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    XC16x
  • Published
    2001
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    144
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    800mW
  • Terminal Position
    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    2.5V
  • Frequency
    40MHz
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    SA*XC167CI
  • Supply Voltage-Max (Vsup)
    2.7V
  • Interface
    CAN, I2C, SPI, USART
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    128kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size
    8K x 8
  • Voltage - Supply (Vcc/Vdd)
    2.35V~2.7V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Core Processor
    C166SV2
  • Peripherals
    PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    16-Bit
  • Program Memory Size
    128KB 128K x 8
  • Connectivity
    CANbus, EBI/EMI, I2C, SPI, UART/USART
  • Bit Size
    16
  • Has ADC
    YES
  • DMA Channels
    NO
  • Data Bus Width
    16b
  • PWM Channels
    YES
  • DAC Channels
    NO
  • Number of Timers/Counters
    5
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    24
  • On Chip Program ROM Width
    8
  • Length
    20mm
  • Height Seated (Max)
    1.6mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Contains Lead
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