XC167CI16F40FBBKXQMA1

Infineon Technologies XC167CI16F40FBBKXQMA1

Part No:

XC167CI16F40FBBKXQMA1

Datasheet:

XC167CI-16F

Package:

144-LQFP

ROHS:

AINNX NO:

4849218-XC167CI16F40FBBKXQMA1

Description:

MCU 16-BIT XC166 CISC/DSP/RISC 128KB FLASH 2.5V/5V 144-PIN TQFP

Products specifications
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    144-LQFP
  • Number of Pins
    144
  • Data Converters
    A/D 16x8/10b
  • Number of I/Os
    103
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~125°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    XC16x
  • Published
    2001
  • JESD-609 Code
    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    144
  • Terminal Finish
    Tin (Sn)
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    800mW
  • Terminal Position
    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Supply Voltage
    2.5V
  • Frequency
    40MHz
  • Pin Count

    a count of all of the component leads (or pins)

    144
  • Supply Voltage-Max (Vsup)
    2.7V
  • Interface
    CAN, EBI/EMI, I2C, SPI, UART, USART
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    128kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size
    8K x 8
  • Voltage - Supply (Vcc/Vdd)
    2.35V~2.7V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Core Processor
    C166SV2
  • Peripherals
    PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    16-Bit
  • Program Memory Size
    128KB 128K x 8
  • Connectivity
    CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
  • Bit Size
    16
  • Has ADC
    YES
  • DMA Channels
    NO
  • Data Bus Width
    16b
  • PWM Channels
    YES
  • DAC Channels
    NO
  • Number of Timers/Counters
    5
  • Address Bus Width

    A computer system has an address bus with 8 parallel lines. This means that the address bus width is 8 bits.

    24
  • Length
    20mm
  • Height Seated (Max)
    1.6mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free
    Contains Lead
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