TC297TP128F300NBCKXUMA1

Infineon Technologies TC297TP128F300NBCKXUMA1

Part No:

TC297TP128F300NBCKXUMA1

Package:

292-LFBGA

ROHS:

AINNX NO:

4859772-TC297TP128F300NBCKXUMA1

Description:

32 BIT AURIX

Products specifications
  • Factory Lead Time
    26 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    292-LFBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Data Converters
    A/D 60x12b, 10 x Sigma-Delta
  • Number of I/Os
    263
  • RAM(byte)
    745472
  • ROM(word)
    8388608
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~125°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series
    AURIX™
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    292
  • ECCN Code
    3A001.A.3
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    IT HAS 21 ADC MODULE, 60 A/D LINES
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.31.00.01
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B292
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    External
  • Speed
    300MHz
  • RAM Size
    240K x 8
  • Voltage - Supply (Vcc/Vdd)
    1.17V~1.43V 2.97V~5.5V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Core Processor
    TriCore™
  • Peripherals
    DMA, WDT
  • Clock Frequency
    300MHz
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    32-Bit Tri-Core
  • Program Memory Size
    8MB 8M x 8
  • Connectivity
    ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
  • Bit Size
    32
  • Has ADC
    YES
  • DMA Channels
    YES
  • EEPROM Size
    768K x 8
  • On Chip Program ROM Width
    8
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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