XE167F96F66LACFXQMA1

Infineon Technologies XE167F96F66LACFXQMA1

Part No:

XE167F96F66LACFXQMA1

Datasheet:

XE167 Datasheet

Package:

144-LQFP Exposed Pad

ROHS:

AINNX NO:

4812943-XE167F96F66LACFXQMA1

Description:

MCU 16-bit XE166 C166 CISC/DSP/RISC 768KB Flash 3.3V 144-Pin LQFP EP

Products specifications
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    144-LQFP Exposed Pad
  • Number of Pins
    144
  • Data Converters
    A/D 24x10b
  • Number of I/Os
    118
  • Watchdog Timers
    Yes
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    XE16x
  • Published
    2008
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    1W
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Frequency
    66MHz
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    SA*XE167F
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3V
  • Interface
    CAN, EBI/EMI, I2C, I2S, LIN, SPI, UART, USART
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    768kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size
    82K x 8
  • Voltage - Supply (Vcc/Vdd)
    3V~5.5V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Core Processor
    C166SV2
  • Peripherals
    I2S, POR, PWM, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    16-Bit
  • Program Memory Size
    768KB 768K x 8
  • Connectivity
    CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
  • Data Bus Width
    16b
  • Number of Timers/Counters
    5
  • Number of ADC Channels
    24
  • Number of PWM Channels
    16
  • Number of I2C Channels
    6
  • Height
    1.5mm
  • Length
    20mm
  • Width
    20mm
  • REACH SVHC
    No SVHC
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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