TC277TP64F200NDCKXUMA1

Infineon Technologies TC277TP64F200NDCKXUMA1

Part No:

TC277TP64F200NDCKXUMA1

Package:

292-LFBGA

ROHS:

AINNX NO:

4854485-TC277TP64F200NDCKXUMA1

Description:

IC MCU 32BIT 4MB FLASH 292LFBGA

Products specifications
  • Factory Lead Time
    26 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    292-LFBGA
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Data Converters
    A/D 60x12b, 6 x Sigma-Delta
  • Number of I/Os
    169
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~125°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series
    AURIX™
  • Published
    2010
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    292
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Frequency
    200MHz
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    S-PBGA-B292
  • Interface
    CAN, Ethernet, I2C, LIN, SPI
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    4MB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    External
  • RAM Size
    472K x 8
  • Voltage - Supply (Vcc/Vdd)
    3V~5.5V
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER
  • Core Processor
    TriCore™
  • Peripherals
    DMA, WDT
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    FLASH
  • Core Size
    32-Bit Tri-Core
  • Program Memory Size
    4MB 4M x 8
  • Connectivity
    ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
  • Bit Size
    32
  • Has ADC
    YES
  • DMA Channels
    YES
  • Data Bus Width
    32b
  • PWM Channels
    NO
  • EEPROM Size
    64K x 8
  • On Chip Program ROM Width
    8
  • Number of A/D Converters
    8
  • Number of ADC Channels
    60
  • Max Junction Temperature (Tj)
    150°C
  • Ambient Temperature Range High

    This varies from person to person, but it is somewhere between 68 and 77 degrees F on average. The temperature setting that is comfortable for an individual may fluctuate with humidity and outside temperature as well. The temperature of an air conditioned room can also be considered ambient temperature.

    125°C
  • Number of SPI Channels
    4
  • Number of Ethernet Channels
    1
  • Height
    1.7mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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