TDK-Epcos B66481P0000X192

Lifecycle Status

Production (Last Updated: 2 years ago)

Supplier Device Package

I 25 x 2

Material

N92

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

N92

Factory Pack QuantityFactory Pack Quantity

324

Part # Aliases

B66481PX192

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

RoHS

Details

Package

Box

Mfr

EPCOS - TDK Electronics

Product Status

Active

Series

B66481

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

--

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Ungapped

Subcategory

Ferrites

Inductance

4.15 uH

Accessory Type

EIQ 25 Core Set

Core Size

25 x 2

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Finish

Uncoated

Core Type

I

Gap

Ungapped

Product

Ferrite Cores

Product Category

a particular group of related products.

Ferrite Cores & Accessories

Width

18.00mm

Height

2.30mm

Length

25.00mm

Diameter

--