TDK-Epcos B64290P0687X038

Supplier Device Package

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Material

T38

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

T38

Core Factor (ΣI/A) mm-1

3.22

Factory Pack QuantityFactory Pack Quantity

4000

Inside Diameter

3.05 mm

Part # Aliases

B64290P687X38

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

RoHS

Details

Core Factor (ΣI/A) mm^-1

3.22

Package

Box

Mfr

EPCOS - TDK Electronics

Product Status

Active

Series

B64290

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

±30%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Ungapped

Subcategory

Ferrites

Inductance

3.9 uH

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Outside Diameter

The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.

5.84 mm

Finish

Parylene

Core Type

Toroid

Gap

Ungapped

Effective Length (le) mm

13.03

Inductance Factor (Al)

3.9µH

Product

Toroids

Product Category

a particular group of related products.

Ferrite Cores & Accessories

Diameter

5.86mm

Length

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Height

3.02mm

Width

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