TDK-Epcos B66482G0000X608

Lifecycle Status

Production (Last Updated: 2 weeks ago)

Number of Pins

-

Material

PC200

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

PC200

Maximum DC Current

-

Factory Pack QuantityFactory Pack Quantity

540

Part # Aliases

B66482GX608

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

Maximum DC Resistance

-

Inside Length

20.2 mm

RoHS

Details

Outside Length

23.2 mm

Package

Bulk

Mfr

EPCOS - TDK Electronics

Product Status

Active

Series

*

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

- 20 %, + 30 %

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Ungapped

Subcategory

Ferrites

Termination Style

-

Inductance

1.4 uH

Accessory Type

-

Core Size

23.2 mm x 12.5 mm

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Product

Ferrite Cores

Product Category

a particular group of related products.

Ferrite Cores & Accessories