TDK-Epcos B65661D0000R087

Supplier Device Package

P 22 x 13

Material

N87

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

N87

Core Factor (ΣI/A) mm-1

0.5

Factory Pack QuantityFactory Pack Quantity

400

Part # Aliases

B65661DR87

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

RoHS

Details

Core Factor (ΣI/A) mm^-1

0.5

Package

Box

Mfr

EPCOS - TDK Electronics

Product Status

Active

Series

B65661

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

-20%, +30%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Ungapped

Subcategory

Ferrites

Inductance

4.1 uH

Core Size

22 x 13

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Finish

Uncoated

Core Type

P (Pot Core)

Gap

Ungapped

Effective Length (le) mm

31.6

Inductance Factor (Al)

4.4µH

Product

Ferrite Cores

Product Category

a particular group of related products.

Ferrite Cores & Accessories

Width

--

Height

6.80mm

Length

--

Diameter

22.00mm