TDK-Epcos B65887H4300X041

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

N41

Factory Pack QuantityFactory Pack Quantity

60

Part # Aliases

B65887H4300X41

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

RoHS

Details

Series

B65887H

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Tolerance

30 %

Type

Ungapped

Subcategory

Ferrites

Inductance

4.3 uH

Core Size

RM 14

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Product

Ferrite Cores

Product Category

a particular group of related products.

Ferrite Cores & Accessories