TDK-Epcos B65519D0000R033

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

M33

Package

Box

Mfr

EPCOS - TDK Electronics

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

1000

Part # Aliases

B65519DR33

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

RoHS

Details

Series

--

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

- 20 %, + 30 %

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Ungapped

Subcategory

Ferrites

Inductance

530 nH

Core Size

9 x 5

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Product

Ferrite Cores

Product Category

a particular group of related products.

Ferrite Cores & Accessories