TDK-Epcos B66363Q0100K187

Supplier Device Package

ETD 39 x 20 x 13

Material

N87

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

N87

Factory Pack QuantityFactory Pack Quantity

200

Part # Aliases

B66363Q100K187

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

RoHS

Details

Outside Length

38.9 mm

Core Factor (ΣI/A) mm^-1

0.74

Package

Bulk

Mfr

EPCOS - TDK Electronics

Product Status

Active

Series

B66363

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Tolerance

10 %

Type

Gapped

Subcategory

Ferrites

Inductance

100 nH

Core Size

38.9 mm x 12.8 mm

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Finish

Uncoated

Core Type

ETD

Gap

Distributed Gapped

Effective Length (le) mm

92.2

Inductance Factor (Al)

100 nH

Product

Ferrite Cores

Product Category

a particular group of related products.

Ferrite Cores & Accessories

Width

0.787 (20.00mm)

Height

0.504 (12.80mm)

Length

1.531 (38.90mm)

Diameter

-