TDK-Epcos B66361GX187

Number of Pins

-

Weight

39.999986 g

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

N87

Unit Weight

1.410958 oz

Factory Pack QuantityFactory Pack Quantity

300

Inside Diameter

-

Part # Aliases

B66361G X187 ETD34/17/11 B66361G0000X187

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

Maximum DC Resistance

-

Inside Length

25.6 mm

RoHS

Details

Outside Length

34 mm

Schedule B

8504900020

Series

B66361G

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Tolerance

- 20 %, + 30 %

Type

Ungapped

Subcategory

Ferrites

Depth

17.5 mm

Termination Style

-

Lead Spacing

the distance between two baselines of lines of type. The word 'leading' originates from the strips of lead hand-typesetters used to use to space out lines of text evenly. The word leading has stuck, but essentially it's a typographer's term for line spacing.

-

Lead Diameter

-

Inductance

2.6 uH

Core Size

34 x 17 x 11

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Product

Ferrite Cores

Product Category

a particular group of related products.

Ferrite Cores & Accessories

Width

11.1 mm

Height

17.5 mm

Length

34 mm