TDK-Epcos B64290L0632X065

Supplier Device Package

--

Material

T65

Core Material

Core materials are produced in a variety of forms including end-grain balsa wood, PVC foam, urethane foam, non-woven core fabrics, and various types of honeycomb materials.

T65

Core Factor (ΣI/A) mm-1

1.3

Core Factor (ΣI/A) mm^-1

1.3

Package

Box

Mfr

EPCOS - TDK Electronics

Product Status

Active

Factory Pack QuantityFactory Pack Quantity

1000

Inside Diameter

10 mm

Part # Aliases

B64290L632X65

Manufacturer

EPCOS / TDK

Brand

EPCOS / TDK

RoHS

Details

Series

B64290

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Ammo Pack

Tolerance

±30%

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Ungapped

Subcategory

Ferrites

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Ferrite Cores & Accessories

Outside Diameter

The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.

20 mm

Finish

Epoxy

Core Type

Toroid

Gap

Ungapped

Effective Length (le) mm

43.55

Inductance Factor (Al)

5.05µH

Product

Toroids

Product Category

a particular group of related products.

Ferrite Cores & Accessories

Width

--

Height

8.10mm

Length

--

Diameter

21.20mm