NXP Semiconductors MCIMX353DJQ5C

Factory Lead Time

18 Weeks

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

400

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

NXP SEMICONDUCTORS

Package Description

17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

Moisture Sensitivity Levels

3

Operating Temperature-Max

70 °C

Operating Temperature-Min

-20 °C

Package Body Material

PLASTIC/EPOXY

Package Code

LFBGA

Package Equivalence Code

BGA400,20X20,32

Package Shape

SQUARE

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Supply Voltage-Max

1.47 V

Supply Voltage-Min

1.33 V

Supply Voltage-Nom

1.8 V

JESD-609 Code

e1

ECCN Code

5A992.C

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

IT ALSO OPERATES AT 1.22 TO 1.47 V

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.31.00.01

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

260

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

compliant

Time@Peak Reflow Temperature-Max (s)

40

JESD-30 Code

S-PBGA-B400

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

uPs/uCs/Peripheral ICs Type

SoC

Seated Height-Max

1.6 mm

Length

17 mm

Width

17 mm