LPC4320FBD144,551

NXP Semiconductors LPC4320FBD144,551

Part No:

LPC4320FBD144,551

Manufacturer:

NXP Semiconductors

Package:

-

AINNX NO:

69823507-LPC4320FBD144,551

Description:

Microcontroller 32-Bit ARM Cortex M4/M0 RISC ROMLess 2.5V/3.3V 144-Pin LQFP

Products specifications
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Mount
    Surface Mount
  • Number of Pins
    144
  • Case/Package
    LQFP
  • Memory Types
    FLASH, ROMless
  • Number of I/Os
    83
  • RoHS
    Compliant
  • Schedule B
    8542310000
  • Watchdog Timers
    Yes
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85 °C
  • Min Operating Temperature
    -40 °C
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    1.5 W
  • Frequency
    204 MHz
  • Interface
    CAN, EBI/EMI, Ethernet, I2C, I2S, IrDA, MMC, SD, SPI, SSP, UART, USART, USB
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    3.6 V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    2.2 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    264 kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • RAM Size
    200 kB
  • Peripherals
    Brown-out Detect/Reset, DMA, POR, PWM, WDT
  • Data Bus Width
    32 b
  • Number of Timers/Counters
    6
  • Core Architecture
    ARM
  • Max Frequency
    204 MHz
  • Number of Programmable I/O
    83
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • REACH SVHC
    No SVHC
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