LPC1111FHN33/101,5

NXP Semiconductors LPC1111FHN33/101,5

Part No:

LPC1111FHN33/101,5

Manufacturer:

NXP Semiconductors

Package:

-

AINNX NO:

69817997-LPC1111FHN33/101,5

Description:

MCU 32-bit LPC1100 ARM Cortex M0 RISC 8KB Flash 3.3V 32-Pin HVQFN EP Tray

Products specifications
  • Mount
    Surface Mount
  • Number of Pins
    33
  • Case/Package
    QFN
  • Memory Types
    FLASH
  • Number of I/Os
    28
  • RoHS
    Compliant
  • Schedule B
    8542310000, 8542310000|8542310000|8542310000|8542310000|8542310000
  • Watchdog Timers
    Yes
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85 °C
  • Min Operating Temperature
    -40 °C
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    1.5 W
  • Frequency
    50 MHz
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3.3 V
  • Interface
    I2C, SPI, UART, USART
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    3.6 V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    1.8 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    8 kB
  • RAM Size
    2 kB
  • Number of Bits
    32
  • Peripherals
    I2C
  • Data Bus Width
    32 b
  • Number of Timers/Counters
    4
  • Core Architecture
    ARM
  • Max Frequency
    50 MHz
  • Number of Programmable I/O
    28
  • Number of UART Channels
    1
  • Number of ADC Channels
    8
  • Number of I2C Channels
    1
  • Number of SPI Channels
    1
  • Height
    950 µm
  • Length
    7.1 mm
  • Width
    7.1 mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • REACH SVHC
    No SVHC
  • Lead Free
    Lead Free
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