LPC2939FBD208,551

NXP Semiconductors LPC2939FBD208,551

Part No:

LPC2939FBD208,551

Manufacturer:

NXP Semiconductors

Package:

-

AINNX NO:

69822479-LPC2939FBD208,551

Description:

MCU 16-bit/32-bit LPC2900 ARM968E-S RISC 768KB Flash 1.8V/3.3V 208-Pin LQFP Tray

Products specifications
  • Mount
    Surface Mount
  • Number of Pins
    208
  • Case/Package
    LQFP
  • Memory Types
    FLASH
  • Number of I/Os
    152
  • RoHS
    Compliant
  • Watchdog Timers
    Yes
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85 °C
  • Min Operating Temperature
    -40 °C
  • Max Power Dissipation

    The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

    1.5 W
  • Frequency
    125 MHz
  • Interface
    CAN, EBI/EMI, I2C, LIN, SPI, UART, USART, USB
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    1.89 V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    1.71 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    768 kB
  • Oscillator Type

    Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

    Internal
  • Peripherals
    DMA, I2C, POR, PWM, WDT
  • Data Bus Width
    32 b
  • Number of Timers/Counters
    6
  • Core Architecture
    ARM
  • Max Frequency
    125 MHz
  • Number of Programmable I/O
    160
  • Number of UART Channels
    2
  • Number of ADC Channels
    3
  • Number of PWM Channels
    6
  • Number of I2C Channels
    2
  • Number of SPI Channels
    3
  • Height
    1.45 mm
  • Length
    28.1 mm
  • Width
    28.1 mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • REACH SVHC
    No SVHC
  • Lead Free
    Lead Free
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