Littelfuse IXTA220N04T2-TRL

Package / Case

TO-263-7

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.29.00.95

Automotive

Unknown

PPAP

Unknown

Category

Power MOSFET

Process Technology

TrenchT2

Channel Mode

Enhancement

Number of Elements per Chip

1

Maximum Drain Source Voltage (V)

40

Maximum Gate Source Voltage (V)

±20

Maximum Continuous Drain Current (A)

220

Maximum Drain Source Resistance (MOhm)

3.5@10V

Typical Gate Charge @ Vgs (nC)

112@10V

Typical Gate Charge @ 10V (nC)

112

Typical Input Capacitance @ Vds (pF)

6820@25V

Maximum Power Dissipation (mW)

360000

Typical Fall Time (ns)

21

Typical Rise Time (ns)

21

Typical Turn-Off Delay Time (ns)

31

Supplier Package

D2PAK

Tab

Tab

PCB changed

2

Package Length

10.41(Max)

Package Width

9.4(Max)

Package Height

4.7(Max)

Mounting

Surface Mount

Maximum Operating Temperature (°C)

175

Minimum Operating Temperature (°C)

-55

Typical Turn-On Delay Time (ns)

15

Vds - Drain-Source Breakdown Voltage

40 V

Vgs th - Gate-Source Threshold Voltage

2 V

Pd - Power Dissipation

360 W

Transistor Polarity

N-Channel

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 175 C

Vgs - Gate-Source Voltage

- 20 V, + 20 V

Minimum Operating Temperature

- 55 C

Mounting Styles

SMD/SMT

Qg - Gate Charge

112 nC

Rds On - Drain-Source Resistance

3.5 mOhms

Id - Continuous Drain Current

220 A

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Technology

Si

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Single

Number of Channels

1 Channel

Channel Type

N