Littelfuse IXTA08N100D2-TRL

Package / Case

TO-263AA-3

EU RoHS

Compliant

ECCN (US)

EAR99

HTS

8541.29.00.40

Automotive

No

PPAP

No

Category

Power MOSFET

Channel Mode

Enhancement

Number of Elements per Chip

1

Maximum Drain Source Voltage (V)

1000

Maximum Gate Source Voltage (V)

±20

Maximum Continuous Drain Current (A)

0.8(Min)

Maximum Drain Source Resistance (MOhm)

21000@0V

Typical Gate Charge @ Vgs (nC)

14.6@5V

Typical Input Capacitance @ Vds (pF)

325@25V

Maximum Power Dissipation (mW)

60000

Typical Fall Time (ns)

48

Typical Rise Time (ns)

57

Typical Turn-Off Delay Time (ns)

34

Typical Turn-On Delay Time (ns)

28

Minimum Operating Temperature (°C)

-55

Maximum Operating Temperature (°C)

150

Mounting

Surface Mount

Package Height

4.7(Max)

Package Width

9.4(Max)

Package Length

10.41(Max)

PCB changed

2

Tab

Tab

Supplier Package

D2PAK

Vds - Drain-Source Breakdown Voltage

1 kV

Vgs th - Gate-Source Threshold Voltage

2 V

Pd - Power Dissipation

60 W

Transistor Polarity

N-Channel

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 150 C

Vgs - Gate-Source Voltage

- 20 V, + 20 V

Minimum Operating Temperature

- 55 C

Mounting Styles

SMD/SMT

Qg - Gate Charge

14.6 nC

Rds On - Drain-Source Resistance

21 Ohms

Id - Continuous Drain Current

800 mA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Technology

Si

Pin Count

a count of all of the component leads (or pins)

3

Configuration

Single

Number of Channels

1 Channel

Channel Type

N