Freescale Semiconductor, Inc. (NXP Semiconductors) MIMX8MQ7DVAJZAA

EU RoHS

Compliant

ECCN (US)

5A992

HTS

8542.31.00.01

Automotive

No

PPAP

No

Family Name

i.MX 8M

Maximum Clock Rate (MHz)

1500

Data Bus Width (bit)

32

Processing Unit

Microcontroller

Watchdog

3

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

95

Interface Type

Ethernet/I2C/SPI/UART/USB

I2C

4

I2S

0

UART

4

Data Cache Size

16KB|32KB

Instruction Cache Size

16KB|32KB

USART

0

PCI

2

Programmability

Yes

Mounting

Surface Mount

Package Height

1.68(Min)

Package Width

17

Package Length

17

PCB changed

621

Supplier Package

FBGA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

NRND

Type

Applications Processor

Pin Count

a count of all of the component leads (or pins)

621

RAM Size

160KB

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

ROM

Program Memory Size

128KB

Core Architecture

ARM

Ethernet

1

USB

2

SPI

3

PWM

4

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

ARM Cortex M4|ARM Cortex A53