Freescale Semiconductor, Inc. (NXP Semiconductors) MCIMX6QP7CVT8AB

EU RoHS

Compliant

ECCN (US)

5A992c.

HTS

8542.31.00.01

SVHC

Yes

Automotive

No

PPAP

No

Family Name

i.MX 6Quad

Maximum Clock Rate (MHz)

800

Data Bus Width (bit)

32

Watchdog

2

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

105

Interface Type

CAN/Ethernet/I2C/I2S/SPI/UART/USB

I2C

3

I2S

1

UART

5

Data Cache Size

32KB

Instruction Cache Size

32KB

USART

0

PCI

1

Programmability

Yes

Ethernet Speed

10Mbps/100Mbps/1000Mbps

Mounting

Surface Mount

Package Height

1.6

Package Width

21

Package Length

21

PCB changed

624

Supplier Package

FBGA

Lead Shape

Ball

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Applications Processor

Pin Count

a count of all of the component leads (or pins)

624

RAM Size

16KB

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

ROM

Program Memory Size

96KB

Core Architecture

ARM

Ethernet

1

USB

4

SPI

5

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

ARM Cortex A9