MCIMX6X2CVN08AB

Freescale Semiconductor, Inc. (NXP Semiconductors) MCIMX6X2CVN08AB

Part No:

MCIMX6X2CVN08AB

Datasheet:

-

Package:

400-LFBGA

AINNX NO:

31802726-MCIMX6X2CVN08AB

Description:

Products specifications
  • Package / Case
    400-LFBGA
  • Supplier Device Package
    400-MAPBGA (17x17)
  • EU RoHS
    Compliant
  • ECCN (US)
    5A992c.
  • HTS
    8542.31.00.01
  • Automotive
    No
  • PPAP
    No
  • Family Name
    i.MX 6SoloX
  • Maximum Clock Rate (MHz)
    800/227
  • Data Bus Width (bit)
    32
  • Processing Unit
    Microprocessor
  • Watchdog
    3
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    105
  • Interface Type
    CAN/Ethernet/I2C/I2S/SPI/UART/USB
  • I2C
    4
  • I2S
    3
  • UART
    6
  • Data Cache Size
    16KB|32KB
  • Instruction Cache Size
    16KB|32KB
  • USART
    0
  • PCI
    0
  • Programmability
    Yes
  • Ethernet Speed
    10Mbps/100Mbps/1000Mbps
  • Mounting
    Surface Mount
  • Package Height
    1.12
  • Package Width
    17
  • Package Length
    17
  • PCB changed
    400
  • Standard Package Name
    BGA
  • Supplier Package
    PBGA
  • Lead Shape
    Ball
  • Package
    Bulk
  • Mfr
    Freescale Semiconductor
  • Product Status
    Active
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 105°C (TA)
  • Series
    i.MX6SX
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    NRND
  • Type
    System-On-Chip
  • Pin Count

    a count of all of the component leads (or pins)

    400
  • Speed
    200MHz, 800MHz
  • RAM Size
    176KB
  • Core Processor
    ARM® Cortex®-A9, ARM® Cortex®-M4
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    ROM
  • Program Memory Size
    96KB
  • Core Architecture
    ARM
  • Voltage - I/O
    1.8V, 2.5V, 2.8V, 3.15V
  • Ethernet
    2
  • Number of Cores/Bus Width
    2 Core, 32-Bit
  • Graphics Acceleration

    Graphics accelerators speed up the displaying of images on the monitor making it possible to achieve effects not otherwise possible - for example, the presentation of very large images or of interactive games in which images need to change quickly in response to user input.

    Yes
  • RAM Controllers
    LPDDR2, LVDDR3, DDR3
  • USB
    3
  • Additional Interfaces
    AC97, CAN, I²C, I²S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
  • Co-Processors/DSP
    Multimedia; NEON™ MPE
  • Security Features

    Security features include authentication of both users and devices as well as authorization of access to different resources such as IoT data, DM, and other system features.

    A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
  • Display & Interface Controllers

    A unit in a computer system consisting of channels and associated control circuitry that connect a number of visual display units with a central processor.

    Keypad, LCD
  • SATA
    -
  • SPI
    5
  • PWM
    8
  • Device Core

    Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

    ARM Cortex M4|ARM Cortex A9
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