Freescale Semiconductor, Inc. (NXP Semiconductors) MCIMX6S6AVM08ABR

EU RoHS

Compliant

ECCN (US)

5A992C

HTS

8542.31.00.01

Automotive

Yes

PPAP

Yes

Family Name

i.MX 6Solo

Maximum Clock Rate (MHz)

800

Data Bus Width (bit)

32

Processing Unit

Microprocessor

Watchdog

2

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

125

Interface Type

CAN/Ethernet/I2C/I2S/SPI/UART/USB

I2C

4

I2S

3

UART

5

USART

0

Programmability

Yes

Ethernet Speed

10Mbps/100Mbps/1000Mbps

Mounting

Surface Mount

Package Height

1.16

Package Width

21

Package Length

21

PCB changed

624

Standard Package Name

BGA

Supplier Package

MAP-BGA

Lead Shape

Ball

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

NRND

Type

Applications Processor

Pin Count

a count of all of the component leads (or pins)

624

RAM Size

128KB

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

ROM

Program Memory Size

96KB

Core Architecture

ARM

Ethernet

1

USB

4

SPI

4

PWM

4

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

ARM Cortex A9