Freescale Semiconductor, Inc. (NXP Semiconductors) MIMXRT1064DVJ6A

EU RoHS

Compliant

ECCN (US)

5A992C

HTS

8542.31.00.01

Automotive

No

PPAP

No

Family Name

i.MX

Maximum Clock Rate (MHz)

600

Data Bus Width (bit)

32

Processing Unit

Microcontroller

Minimum Operating Temperature (°C)

0

Maximum Operating Temperature (°C)

85

Interface Type

CAN/Ethernet/I2C/I2S/SPI/UART/USB

I2C

4

I2S

3

UART

8

Data Cache Size

32KB

Instruction Cache Size

32KB

USART

0

PCI

0

Programmability

Yes

Ethernet Speed

10Mbps/100Mbps

Mounting

Surface Mount

Package Height

1.18(Max)

Package Width

12

Package Length

12

PCB changed

196

Standard Package Name

BGA

Supplier Package

LFBGA

Lead Shape

Ball

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

NRND

Type

Applications Processor

Pin Count

a count of all of the component leads (or pins)

196

RAM Size

1MB

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

Flash

Program Memory Size

4MB

Core Architecture

ARM

Ethernet

2

USB

1

SPI

4

PWM

4

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

ARM Cortex M7