Freescale Semiconductor, Inc. (NXP Semiconductors) MCIMX353DVM5BR2

EU RoHS

Compliant

ECCN (US)

5A002

SVHC

Yes

Automotive

No

PPAP

No

Family Name

i.MX35

Maximum Clock Rate (MHz)

532

Data Bus Width (bit)

32

Processing Unit

Microprocessor

Watchdog

1

Minimum Operating Temperature (°C)

-20

Maximum Operating Temperature (°C)

70

Interface Type

CAN/Ethernet/I2C/I2S/SPI/SSI/UART/USB

I2C

3

I2S

2

UART

3

USART

0

Programmability

Yes

Ethernet Speed

10Mbps/100Mbps

Mounting

Surface Mount

Package Height

1.18

Package Width

17

Package Length

17

PCB changed

400

Standard Package Name

BGA

Supplier Package

MAP-BGA

Lead Shape

Ball

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape and Reel

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Type

Applications Processor

Pin Count

a count of all of the component leads (or pins)

400

RAM Size

128KB

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

ROM

Program Memory Size

32KB

Ethernet

1

USB

2

SPI

2

PWM

1

Device Core

Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

ARM1136JF-S