AGASTAT 171508-8

Mounting Type

Surface Mount

Package / Case

DO-220AA

Supplier Device Package

DO-220AA (SMP)

Material - Insulation

-

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

171508-8-ND A135208

Contact Materials

Copper

Series

eSMP®

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Crimp

Color

Red

Base Part Number

SE10PG

Contact Finish

Tin

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

18-22 AWG

Speed

Standard Recovery >500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

5µA @ 400V

Voltage - Forward (Vf) (Max) @ If

1.05V @ 1A

Operating Temperature - Junction

-55°C ~ 175°C

Voltage - DC Reverse (Vr) (Max)

400V

Current - Average Rectified (Io)

1A

Insulation Diameter

0.105 ~ 0.140 (2.67mm ~ 3.56mm)

Insulation

Insulated

Terminal Type

Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.

Circular

Capacitance @ Vr, F

--

Stud/Tab Size

-

Reverse Recovery Time (trr)

780ns

Features

Serrated Termination

Thickness

0.031 (0.79mm)

Length - Overall

0.799 (20.29mm)

Width - Outer Edges

0.280 (7.11mm)