AGASTAT 8-33466-3

Mounting Type

Surface Mount

Package / Case

DO-220AA

Supplier Device Package

DO-220AA (SMP)

Material - Insulation

-

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

8334663

Contact Materials

Copper

Series

eSMP®

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Crimp

Color

-

Base Part Number

SE10PJ

Contact Finish

Tin

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

6 AWG

Speed

Standard Recovery >500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

5µA @ 600V

Voltage - Forward (Vf) (Max) @ If

1.05V @ 1A

Operating Temperature - Junction

-55°C ~ 175°C

Voltage - DC Reverse (Vr) (Max)

600V

Current - Average Rectified (Io)

1A

Insulation Diameter

-

Insulation

Non-Insulated

Terminal Type

Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.

Circular

Capacitance @ Vr, F

--

Stud/Tab Size

5/16 Stud

Reverse Recovery Time (trr)

780ns

Features

Brazed Seam, Serrated Termination

Thickness

0.057 (1.45mm)

Length - Overall

1.246 (31.65mm)

Width - Outer Edges

0.625 (15.88mm)