AGASTAT 132081-1

Mounting Type

Surface Mount

Package / Case

DO-214AB, SMC

Supplier Device Package

SMC (DO-214AB)

Material - Insulation

-

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Contact Materials

Copper

Series

--

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Crimp

Color

-

Contact Finish

Nickel

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

4 AWG

Speed

Standard Recovery >500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

10µA @ 400V

Voltage - Forward (Vf) (Max) @ If

1.15V @ 5A

Operating Temperature - Junction

-65°C ~ 150°C

Voltage - DC Reverse (Vr) (Max)

400V

Current - Average Rectified (Io)

5A

Insulation Diameter

-

Insulation

Non-Insulated

Terminal Type

Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.

Circular

Capacitance @ Vr, F

40pF @ 4V, 1MHz

Stud/Tab Size

-

Features

High Temperature

Thickness

-

Length - Overall

1.213 (30.80mm)

Width - Outer Edges

0.465 (11.81mm)