AGASTAT 320138

Mounting Type

Surface Mount

Package / Case

DO-220AA

Supplier Device Package

DO-220AA (SMP)

Material - Insulation

-

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

320138-ND A27095

Contact Materials

Copper

Series

eSMP®

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Crimp

Color

-

Contact Finish

Tin

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

2 AWG

Speed

Fast Recovery = 200mA (Io)

Diode Type

Schottky

Current - Reverse Leakage @ Vr

150µA @ 20V

Voltage - Forward (Vf) (Max) @ If

550mV @ 2A

Voltage - DC Reverse (Vr) (Max)

20V

Current - Average Rectified (Io)

2A

Insulation Diameter

-

Insulation

Non-Insulated

Terminal Type

Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.

Circular

Capacitance @ Vr, F

110pF @ 4V, 1MHz

Stud/Tab Size

1/4 Stud

Features

Serrated Termination

Thickness

0.070 (1.78mm)

Length - Overall

1.657 (42.09mm)

Width - Outer Edges

0.890 (22.61mm)