AGASTAT 53402-1

Mounting Type

Surface Mount

Package / Case

DO-220AA

Supplier Device Package

DO-220AA (SMP)

Material - Insulation

Polyvinylidene Fluoride (PVDF)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Other Names

534021

Contact Materials

Copper

Series

eSMP®

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Crimp

Color

Yellow

Base Part Number

SS2PH10

Contact Finish

Tin-Lead

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

24-26 AWG

Speed

Fast Recovery = 200mA (Io)

Diode Type

Schottky

Current - Reverse Leakage @ Vr

1µA @ 100V

Voltage - Forward (Vf) (Max) @ If

800mV @ 2A

Operating Temperature - Junction

-55°C ~ 175°C

Voltage - DC Reverse (Vr) (Max)

100V

Current - Average Rectified (Io)

2A

Insulation Diameter

0.032 ~ 0.082 (0.81mm ~ 2.08mm)

Insulation

Insulated

Terminal Type

Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.

Circular

Capacitance @ Vr, F

65pF @ 4V, 1MHz

Stud/Tab Size

6 Stud

Features

Radiation Resistant, Serrated Termination

Thickness

0.027 (0.69mm)

Length - Overall

0.792 (20.12mm)

Width - Outer Edges

0.250 (6.35mm)