Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES
Number of Terminals
2
Transistor Element Material
SILICON
Factory Pack QuantityFactory Pack Quantity
10
Manufacturer
Advanced Semiconductor, Inc.
Brand
Advanced Semiconductor, Inc.
RoHS
Details
Package Description
FLANGE MOUNT, R-CDFM-F2
Package Style
FLANGE MOUNT
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Reflow Temperature-Max (s)
30
Operating Temperature-Max
150 °C
Manufacturer Part Number
AGR09085EF
Package Shape
RECTANGULAR
Number of Elements
1
Part Life Cycle Code
Active
Ihs Manufacturer
BROADCOM LTD
Risk Rank
5.25
Drain Current-Max (ID)
8.5 A
Packaging
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Tray
JESD-609 Code
e0
ECCN Code
EAR99
Terminal Finish
TIN LEAD
Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
HIGH RELIABILITY
Subcategory
MOSFETs
Technology
Si
Terminal Position
DUAL
Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
FLAT
Peak Reflow Temperature (Cel)
225
Reach Compliance Code
compliant
JESD-30 Code
R-CDFM-F2
Qualification Status
An indicator of formal certification of qualifications.
Not Qualified
Configuration
SINGLE
Operating Mode
A phase of operation during the operation and maintenance stages of the life cycle of a facility.
ENHANCEMENT MODE
Case Connection
SOURCE
Transistor Application
AMPLIFIER
Polarity/Channel Type
N-CHANNEL
Product Type
a group of products which fulfill a similar need for a market segment or market as a whole.
RF MOSFET Transistors
Drain Current-Max (Abs) (ID)
8.5 A
DS Breakdown Voltage-Min
65 V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Highest Frequency Band
ULTRA HIGH FREQUENCY BAND
Product Category
a particular group of related products.
RF MOSFET Transistors